Shenzhen Wanbo Hi-Tech Co., Ltd.
Professional manufacturer of SMT assembly machines
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SMT patches and inspection equipment
Set Mark
Steps: Find the Mark position on the PCB board, as shown in [Figure 2.5.6.1], put the mark box to the mark position,
then click 'Register' to pop up the registration window (as shown in Figure 2.5.6.2) to adjust the parameters,
click [Registration Criteria] to complete the registration of a Mark. Register another Mark as described above
In normal testing, the position of the same model plate must be in the same position, allowing an offset of 2mm,
in case of mark correction failure, modify the upper limit value and adjust the brightness and
contrast to the OK value range under the condition of determining that the mark point and the mark box are not offset.
Once done, click 'Next' to enter the CAD import
Function parameter
| SZ-X1 Product Specification | ||
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Test items | Programming mode | CAD data impor t automatically for component librar y |
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After reflux fuenace |
Component: Wrong par ts,missing par ts,polarity,deviation,monument,reversal,damage,lc bending,doreign matter, etc Solder joints:less tin,more tin,tin hole,bridging,tin coating,false tin,tin bead,etc | |
| Minimum paet test | Theoigh the resolution the minimum measuradle is 03015(01005)chip&0.3 pitch IC | |
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After Wave Soldering | Less tin,more tin,tin hole,false tin,bridge, tin psckage,tin beda,etc | |
