SZ-X3 Product Specification
Imaging System
Camera: 5 megapixel high definition intelligent industrial camera
Camera resolution Standard configuration:15um/PixelFOV:38.0mm*30.0mm;Optional:20um,10um
Light source:RRGB high gray LED light source
Test items
Programming mode:CAD data impor t automatically for component librar y
After reflux fuenace :
Component: Wrong par ts,missing par ts,polarity,deviation,monument,reversal,damage,lc bending,doreign matter, etc
Solder joints:less tin,more tin,tin hole,bridging,tin coating,false tin,tin bead,etc
Minimum paet test:Theoigh the resolution the minimum measuradle is 03015(01005)chip&0.3 pitch IC
After Wave Soldering:Less tin,more tin,tin hole,false tin,bridge, tin psckage,tin beda,etc
Features
1.With wave peak welding and SMT welding spot and other production process detection algorithm
2.The CCD is placed above the track and the image is taken under the lens
3.With remote debugging &programming, non-stop debugging function
4.Readable2DBarcode(laser &print)
5.Offline inspection for SMT
6.SPC has complete functions, can remotely collect production bad information, and automatically generate various production repor ts
7.A/B side automatic switching program function
8.Plate bending automatic compensation function.FPC applicable
